Korean J. Met. Mater.
2017;55(3):165-172. Published online 2017 Mar 3
Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion..... More