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Tae-Jin Yoon 1 Article
899 Effect of Bonding Pressure and Bonding Time on the Tensile Properties of Cu-Foam / Cu-Plate Diffusion Bonded Joint
Cu foam / Cu plate 간 고상확산접합부의 인장성질에 미치는 접합압력과 유지시간의 영향
Sang-Ho Kim, Hoe-Jun Heo, Tae-Jin Yoon, Chung-Yun Kang
김상호, 허회준, 윤태진, 강정윤
Korean J. Met. Mater. 2016;54(12):899-907.   Published online 2016 Dec 5
DOI: https://doi.org/10.3365/KJMM.2016.54.12.899

Abstract
Open cell Cu foam, which has been widely utilized in various industries because of its high thermal conductivity, lightweight and large surface area, was successfully joined with Cu plate by diffusion bonding. To prevent excessive deformation of the Cu foam during bonding process, the bonding pressure should be lower than..... More

      
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