Sang-Yeob Kim, Sung-Min Jeon, Hyun-Jun Park, Seong-Hyun Kim, Jong-Jin Shin, Oh-Sung Song김상엽, 전성민, 박현준, 김승현, 신종진, 송오성
Korean J. Met. Mater. 2024;62(9):705-712. Published online 2024 Sep 5
DOI:
https://doi.org/10.3365/KJMM.2024.62.9.705
Abstract
This study investigated changes in electrical and mechanical properties, as well as the high humidity reliability of 18 μm-diameter silver alloy wires with palladium contents of 1.1, 2.5, 3.0, and 4.0 wt%, for semiconductor packaging. We also compared the formation of Free Air Ball (FAB) and the high humidity reliability.....
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