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Seonghun Park 1 Article
908 Kinetics of Intermetallic Compounds Growth Induced by Electromigration of Sn-0.7Cu Solder
Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측
Min-Hyeok Heo, Namhyun Kang, Seonghun Park, Jun-Ki Kim, Won Sik Hong
허민혁, 강남현, 박성훈, 김준기, 홍원식
Korean J. Met. Mater. 2016;54(12):908-915.   Published online 2016 Dec 5
DOI: https://doi.org/10.3365/KJMM.2016.54.12.908

Abstract
The reliability of printed circuit boards (PCB) has emerged as a critical concern as the size of solder bump decreases and current density to solder bump increases by fine pitch formation. The main failure mode of solder bumps is open-circuits due to void formation as intermetallic compounds (IMC) grow, mainly..... More

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