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Minhyung Choi 1 Article
449 Effect of Via Pitch on the Extrusion Behavior of Cu-filled TSV
Seho Kee, Wonjoong Kim, Jaepil Jung, Minhyung Choi
Korean J. Met. Mater. 2018;56(6):449-458.   Published online 2018 Jun 4
DOI: https://doi.org/10.3365/KJMM.2018.56.6.449

Abstract
In this study, the extrusion behavior of Cu fill material in a through-Si-via (TSV) subjected to thermal loading was investigated. The Cu filling of the TSV was accomplished using pulse periodic reverse (PPR) electroplating. To study the extrusion, TSVs of varying via pitch were filled with Cu by electroplating. Defect-free Cu..... More

                        
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