Korean J. Met. Mater.
2018;56(6):449-458. Published online 2018 Jun 4
In this study, the extrusion behavior of Cu fill material in a through-Si-via (TSV) subjected
to thermal loading was investigated. The Cu filling of the TSV was accomplished using pulse periodic reverse (PPR) electroplating. To study the extrusion, TSVs of varying via pitch were filled with Cu by electroplating. Defect-free Cu..... More