Hyo Sang Kang, Joo Hyung Lee, Jae Hwa Park, Hee Ae Lee, Won Il Park, Seung Min Kang, Sung Chul Yi
Korean J. Met. Mater.
2019;57(9):582-588. Published online 2019 Aug 21
Chemical mechanical polishing (CMP) of bulk AlN was performed with colloidal silica slurry at pH 9 for different times. The result shows that colloidal silica slurry at pH 9, which has the relatively high surface charge of -50.7 mV is most stable, and it was selected as chemically optimum condition..... More