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Jioh Shin 1 Article
366 Effect of Sn Content on Filler and Bonding Characteristics of Active Metal Brazed Cu/Al2O3 Joint
Jioh Shin, Ashutosh Sharma, Do-hyun Jung, Jae Pil Jung
Korean J. Met. Mater. 2018;56(5):366-374.   Published online 2018 May 8
DOI: https://doi.org/10.3365/KJMM.2018.56.5.366

Abstract
This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/ Al2O3 joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and..... More

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