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Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current
알루미늄-구리 이종 도체 접합부에서 직류 전기 인가에 따른 금속간화합물의 성장 거동
Jeong-Ik Kim, Sung-woo Jin, Jinwook Jung, Hyun-Min Sung, Hye-Jin Jeong, Siwook Park, Ju-Won Park, Heung Nam Han김정익, 진성우, 정진욱, 성현민, 정혜진, 박시욱, 박주원, 한흥남
Korean J. Met. Mater. 2017;55(6):372-378. Published online 2017 Jun 1 DOI: https://doi.org/10.3365/KJMM.2017.55.6.372
Abstract
Aluminum conductors are increasingly replacing copper because Al has lower cost and lighter weight, and consequently the demand for Al-Cu joints for industrial applications is growing. However, an intermetallic compound is known to grow at the Al-Cu interface, and will result in fracture if it grows above a critical thickness...... More
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