Abstract
A superelastic titanium alloy was subjected to uniaxial tensile deformation at room temperature. The microstructural evolution and deformation mechanisms of the superelastic titanium alloy were investigated by electron backscatter diffraction (EBSD) and X-ray diffraction (XRD). Multiple deformation mechanisms including stress-induced martensitic transformation (SIMT), dislocation slip, {332}<113> and {112}<111> mechanical twinning..... More

Abstract
Aluminum conductors are increasingly replacing copper because Al has lower cost and lighter weight, and consequently the demand for Al-Cu joints for industrial applications is growing. However, an intermetallic compound is known to grow at the Al-Cu interface, and will result in fracture if it grows above a critical thickness...... More