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Dong Ik Jeong 1 Article
312 Effects of Post-annealing Condition on Interfacial Reaction and Bonding Strength of Cu/Sn-3.0Ag-0.5Cu/Al Joint for Heat Dissipation Module Application
방열 모듈 적용을 위한 Cu/Sn-3.0Ag-0.5Cu/Al 접합부의 계면 반응 및 접합강도에 미치는 후속 열처리 영향 분석
Dong Ik Jeong, Gahui Kim, Doheon Kim, Minchul Oh, Geon-Hong Kim, Young-Bae Park
정동익, 김가희, 김도헌, 오민철, 김건홍, 박영배
Korean J. Met. Mater. 2024;62(4):312-322.   Published online 2024 Mar 28
DOI: https://doi.org/10.3365/KJMM.2024.62.4.312

Abstract
The effects of post-annealing times at 150°C on the bonding strength and interfacial characteristics of Cu/Sn-3.0Ag-0.5Cu (SAC305)/Al were systematically evaluated. In the as-bonded sample, Cu6Sn5 intermetallic compound (IMC) was formed at the upper Cu/SAC305 interface, while Ag3Al IMC was formed at the lower SAC305/Al interface, and a black layer of..... More

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